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Same model may have multiple batches, images only for reference.
A2F500M3G-1FG256M Real Image
Same model may have multiple batches, images only for reference.

A2F500M3G-1FG256M

Part No A2F500M3G-1FG256M
Manufacturer Microsemi Corporation
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 100MHZ 256FBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Manufacturer Microsemi Corporation
Packaging Tray
Architecture MCU, FPGA
Core Processor ARM Cortex -M3
Flash Size 512KB
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC 3 FPGA, 500K Gates, 11520 D-Flip-Flops
Temperature Range - Operating -55°C ~ 125°C
Manufacturer Package 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Number of I/O MCU - 25, FPGA - 66
Part Number Series A2F500M3G
Manufacturer Pack Quantity 90
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812208-A2F500M3G-1FG256M
Ultra Librarian 3D Model Ultra Librarian A2F500M3G-1FG256M CAD Model

Description

The Microsemi Corporation A2F500M3G-1FG256M is a low-popularity component from Microsemi Corporation.

  • FPGA Type: ProASIC 3
  • Gates: 500K
  • D-Flip-Flops: 11520
  • Speed: 100MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Peripherals: DMA, POR, WDT
  • RAM Size: 64KB
  • Flash Size: 512KB
  • Temperature Range: -55°C to 125°C
  • Package: 256-FPBGA (17x17)

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