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A3P250-FG144I

Part No A3P250-FG144I
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description ProASIC3 Flash Family FPGAs | IC FPGA 97 I/O 144FBGA
Sample
Rohs State Need to verify
ECAD Module
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Categories Integrated Circuits
Manufacturer Microsemi Corporation
Total RAM Bits 36864
The number of I/O 97
Number of Gates 250000
Supply Voltage (V) 1.425V ~ 1.575V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 144-LBGA
Supplier Device Package 144-FPBGA (13x13)
Family Part Number A3P250
Manufacturer Pack Quantity 160
MSL Level 3 (168 Hours)
Win Source Part Number 1134646-A3P250-FG144I
Manufacturer Homepage www.actel.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian A3P250-FG144I CAD Model

Description

The A3P250-FG144I is a member of the ProASIC3 family of Field Programmable Gate Arrays (FPGAs) manufactured by Microsemi Corporation (now Microchip Technology). These FPGAs are known for their flash-based architecture, which offers advantages such as non-volatility, low power consumption, and security. They are well-suited for a range of applications where reliability and security are paramount.

Applications:

  • Industrial Control Systems: Implementing custom control logic and communication interfaces.
  • Medical Equipment: Used in medical imaging and diagnostic equipment where data security is critical.
  • Aerospace and Defense: Employed in secure communication systems and navigation equipment.
  • Networking Equipment: Implementing custom packet processing and routing algorithms.

Features:

  • Flash-Based Architecture: Non-volatile configuration, eliminating the need for external configuration memory.
  • Low Power Consumption: Ideal for battery-powered and portable devices.
  • Security Features: Protects against unauthorized access and reverse engineering.
  • Programmable Logic Blocks: Configurable logic elements for implementing custom functions.
  • Embedded Memory: On-chip memory blocks for storing data and code.

Benefits:

  • Secure Configuration: Flash-based architecture prevents tampering and unauthorized modification.
  • Low Power Operation: Extends battery life and reduces overall system power consumption.
  • Design Flexibility: Allows for customization and adaptation to changing requirements.
  • Rapid Prototyping: Enables faster development and testing cycles.
  • Integration: Reduces the number of discrete components required in a system.

Additional Details:

The A3P250-FG144I features a specific number of logic cells, memory blocks, and I/O pins. The FG144 package refers to the 144-pin Fine-Pitch Ball Grid Array (FBGA) package. Key specifications include the number of logic elements (LEs), the amount of embedded memory, the number of I/O pins, and the operating voltage. The FPGA supports various programming languages and development tools. The flash-based architecture allows for instant-on operation and eliminates the need for external configuration memory. The security features protect the FPGA from unauthorized access and modification. Detailed specifications and application notes are available in the product datasheet. Proper thermal management is essential for reliable operation. The FPGA is lead-free and RoHS compliant. It is important to consult the manufacturer's datasheet for detailed information on pinout, power requirements, and configuration guidelines. The "I" in the part number typically indicates an industrial temperature range.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $62.1641 $62.1641
2+ $51.0065 $102.0130
4+ $49.4125 $197.6500
5+ $47.8186 $239.0930
6+ $46.2246 $277.3476
8+ $41.4428 $331.5424
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 52 pieces
Order Increment : 1 pcs
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