The LDD21900M03E580 is a common mode choke manufactured by Murata Electronics North America. Common mode chokes are passive electronic components used to suppress common-mode noise in electronic circuits. They are particularly effective in reducing electromagnetic interference (EMI) and improving signal integrity. This component is designed for surface mount applications and finds use in various electronic devices to filter out unwanted noise.

Applications

• USB Data Lines
• HDMI Interfaces
• Ethernet Ports
• LVDS Interfaces
• Audio Circuits

Features

• High Common Mode Impedance: Provides effective suppression of common-mode noise.
• Low Differential Mode Impedance: Minimizes signal attenuation in differential mode.
• Surface Mount Package: Designed for easy assembly onto printed circuit boards.
• Compact Size: Allows for high-density board layouts.
• RoHS Compliant: Meets environmental regulations regarding hazardous substances.
• Wide Operating Temperature Range: Suitable for use in various environmental conditions.

Benefits

• Noise Reduction: Suppresses common-mode noise, improving signal integrity and reducing EMI.
• Improved System Performance: Enhances the performance of electronic devices by reducing noise interference.
• Reduced EMI: Minimizes electromagnetic interference, preventing interference with other devices.
• Easy Integration: Surface mount package simplifies assembly and reduces manufacturing costs.
• Compact Design: Allows for use in space-constrained applications.

Additional Details

The LDD21900M03E580 common mode choke is characterized by its impedance, inductance, and rated current. It is designed to attenuate noise in a specific frequency range, typically in the MHz range. The component is constructed using ferrite cores and winding techniques to achieve high common mode impedance and low differential mode impedance. It is widely used in high-speed data transmission lines to improve signal quality and prevent data corruption. The surface mount package facilitates automated assembly processes and allows for high-density board layouts.