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BGA2709,115

Part No BGA2709,115
Manufacturer NXP / Nexperia
Catalog RF Amplifiers
Description MMIC AMPLIFIER 6TSSOP
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories RF/IF and RFID
Manufacturer NXP
Packaging Reel package
Part Status Obsolete(EOL)
Frequency 1.8GHz
Gain 22.7dB
Noise Figure 4dB
RF Type ISM
Operating Supply Voltage 5 V ~ 6 V
Operating Supply Current 23.5mA
Test Frequency 1GHz
Package 6-TSSOP, SC-88, SOT-363
Manufacturer Package 6-TSSOP
Win Source Part Number 769994-BGA2709,115
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian BGA2709,115 CAD Model

Description

Product Overview: BGA2709,115 by NXP Semiconductors

The BGA2709,115 is a high-performance, silicon germanium carbon (SiGe:C) monolithic microwave integrated circuit (MMIC) amplifier designed and manufactured by NXP Semiconductors. This versatile amplifier is suitable for a wide range of applications in RF systems, including wireless communication, satellite TV receivers, and various other high-frequency applications.

The BGA2709,115 operates over a broad frequency range, offering consistent performance and reliability. Its high linearity and low noise figure make it an excellent choice for signal amplification needs, where maintaining signal integrity is crucial. The device is designed to provide a high gain while consuming low current, making it energy-efficient and suitable for battery-powered devices.

Key features of the BGA2709,115 include:

  • Wideband operation, supporting a range of frequencies for maximum versatility.
  • High gain, ensuring amplified signals without significant loss of quality.
  • Low noise figure, which minimizes additional noise in the signal path and preserves signal-to-noise ratio.
  • Excellent linearity, which maintains the integrity of the original signal across various power levels.
  • Low current consumption, making it ideal for portable and battery-operated devices.
  • Small package size, allowing for integration into compact system designs without sacrificing performance.

The BGA2709,115 comes in a small, leadless 6-pin package which is designed for easy surface mount assembly. The compact form factor combined with its robust performance characteristics makes it a preferred choice for designers looking to optimize their RF designs for space, power, and performance.

NXP Semiconductors is known for their commitment to quality and the BGA2709,115 is no exception. It is built to meet the high standards of reliability and performance that customers expect from NXP products. Whether you're designing for commercial or industrial applications, the BGA2709,115 offers a solution that balances performance with efficiency.

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Pricing & Ordering

Quantity Unit Price Ext. Price
140+ $0.4204 $58.8560
335+ $0.3453 $115.6755
520+ $0.3338 $173.5760
715+ $0.3234 $231.2310
925+ $0.3130 $289.5250
1,235+ $0.2807 $346.6645
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 68,000 pieces
MOQ: 140 pcs
Order Increment : 1 pcs
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