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BGB204/3/S02

Part No BGB204/3/S02
Manufacturer NXP / Nexperia
Catalog HOT - SALES and EOL Components (B - C)
Sample
Rohs State rohs
ECAD Module
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Manufacturer NXP
Win Source Part Number 235283-BGB204/3/S02
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian BGB204/3/S02 CAD Model

Description

The BGB204/3/S02 is a cutting-edge, high-performance Bluetooth Silicon Radio (SiRadio) chip from NXP Semiconductors. This advanced product is designed to cater to the growing demands of wireless communication in a wide range of applications. It is a versatile solution that integrates seamlessly into various devices requiring Bluetooth connectivity, such as smartphones, tablets, wearables, automotive infotainment systems, and smart home devices.

Key Features

  • Bluetooth Compliance: Fully compliant with the Bluetooth 2.1 + EDR specification, this chip ensures compatibility with a broad array of Bluetooth-enabled devices.
  • Enhanced Data Rate (EDR): Offers an Enhanced Data Rate of up to 3 Mbps, providing faster data transfer speeds and improved efficiency.
  • Low Power Consumption: Designed for energy efficiency, the BGB204/3/S02 is ideal for battery-powered devices, contributing to longer battery life and reduced power costs.
  • Integrated RF Transceiver: Features an integrated RF transceiver with a high level of integration, reducing the need for external components and simplifying the design process.
  • Compact Form Factor: Its small footprint allows for easy integration into space-constrained applications without compromising performance.

Applications

The BGB204/3/S02 is suitable for a wide array of applications, including but not limited to:

  • Wireless Headsets and Earbuds
  • Automotive Hands-Free Systems
  • Personal Digital Assistants (PDAs) and Smartphones
  • Wireless Speakers and Audio Streaming Devices
  • Health and Fitness Trackers
  • Smart Home Automation

Technical Specifications

The BGB204/3/S02 boasts an impressive set of technical specifications that make it an ideal choice for developers and manufacturers looking to incorporate Bluetooth functionality into their products. Some of its technical highlights include:

  • Operating Voltage Range: 1.7V to 3.6V
  • Operating Temperature Range: -40°C to 85°C
  • Package: Small HVQFN32 package

In conclusion, the BGB204/3/S02 from NXP Semiconductors is a powerful and efficient Bluetooth SiRadio chip that offers a combination of high performance, low power consumption, and compact design, making it an excellent choice for a multitude of wireless applications.

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