The IP4052CX20/LF,135 is a cutting-edge EMI filtering device with integrated ESD protection, designed and manufactured by NXP Semiconductors. This device is specifically engineered to provide a high level of signal integrity while safeguarding sensitive electronic components from the potentially damaging effects of Electrostatic Discharge (ESD) and Electromagnetic Interference (EMI).

Key Features

• EMI Filtering: The IP4052CX20/LF,135 incorporates multiple high-quality filter circuits that effectively attenuate unwanted EMI noise, ensuring clear signal transmission and reducing the risk of data corruption.
• ESD Protection: It offers robust ESD protection to IEC61000-4-2 Level 4 standards, safeguarding against surges up to ±15kV (air discharge) and ±8kV (contact discharge).
• Low Clamping Voltage: The device features a low clamping voltage, which enhances the protection of connected circuits by limiting the voltage spikes during ESD events.
• Integration: The integration of EMI filters and ESD protection in a single package allows for a reduction in component count, saving valuable PCB space and simplifying the design process.
• Applications: Ideal for use in high-speed data lines, USB interfaces, mobile phones, and other portable devices where space is at a premium and protection from EMI and ESD is crucial.

Technical Specifications

The device features a 5.5V working voltage and a low leakage current, making it suitable for battery-powered applications. The IP4052CX20/LF,135 is designed with a low-pass filter topology, providing excellent insertion loss characteristics over a broad frequency range.

Package and Quality

The IP4052CX20/LF,135 is offered in a lead-free, RoHS-compliant, small-outline package, ensuring compatibility with modern environmentally friendly manufacturing processes. NXP's commitment to quality ensures that this product meets high standards for reliability and performance.

Ordering Information

When ordering this product, the full part number IP4052CX20/LF,135 should be used to specify the package tape and reel configuration suitable for automated assembly processes.