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SPC5777CK3MME3R

Part No SPC5777CK3MME3R
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT 8MB FLASH 416MAPBGA  /  e200z7 series Microcontroller IC 32-Bit Tri-Core 264MHz 8MB (8M x 8) FLASH 416-MAPBGA (27x27)
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr NXP USA Inc.
Series MPC57xx
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
RAM Size 512K x 8
Supply Voltage - Operating 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Base Product Number SPC5777
Other Names 935320923518
Standard Package 500
MSL Level 3 (168 Hours)
ECCN 5A002A1
HTSUS 8542.31.0001
Win Source Part Number 1263908-SPC5777CK3MME3R
Ultra Librarian 3D Model Ultra Librarian SPC5777CK3MME3R CAD Model

Description

The SPC5777CK3MME3R is a state-of-the-art microcontroller unit (MCU) from NXP Semiconductors, designed to cater to the rigorous demands of automotive and industrial applications. This high-performance product is part of the MPC57xx family, which is renowned for its exceptional processing capabilities, safety features, and reliability in critical systems.

Key Features

  • Processing Power: At the heart of the SPC5777CK3MME3R is a powerful dual-core e200z7 Power Architecture CPU, which operates at speeds of up to 264 MHz, providing ample computational resources for complex tasks.
  • Memory: The device is equipped with a robust memory architecture, including 4 MB of flash memory for program storage and 592 KB of RAM for efficient data handling.
  • Advanced Timer Units: Multiple Motor Control and General Purpose Timer Units are available, making it ideal for precise control applications such as engine management and vehicle dynamics.
  • Enhanced Safety Features: To ensure the highest safety standards, the MCU incorporates features like a Memory Protection Unit (MPU), Error Correction Code (ECC) on both flash and RAM, and a Safety Integrity Level (SIL) that meets the ISO 26262 standard.
  • Communication Interfaces: A comprehensive set of communication interfaces is provided, including CAN, LIN, Ethernet, and FlexRay, ensuring seamless integration with various automotive networks.

Applications

The SPC5777CK3MME3R is engineered to address the sophisticated needs of automotive powertrain systems, body control modules, and advanced driver-assistance systems (ADAS). It's also well-suited for industrial control systems that require high levels of real-time performance and reliability.

Quality and Reliability

NXP's commitment to quality is evident in the SPC5777CK3MME3R, which is manufactured to meet the stringent quality requirements of the automotive industry. The product is available in a 416-Ball MAPBGA package that is designed for optimal thermal performance and space-saving on the PCB.

Environmental Compliance

In alignment with global environmental standards, the SPC5777CK3MME3R is RoHS compliant, which means it is manufactured with a focus on sustainability, reducing the use of hazardous substances.

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