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TZA3041BHL

Part No TZA3041BHL
Manufacturer NXP / Nexperia
Catalog HOT - SALES and EOL Components (T)
Description Gigabit Ethernet/Fibre Channel laser drivers
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ECAD Module
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Manufacturer NXP
Win Source Part Number 384269-TZA3041BHL
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian TZA3041BHL CAD Model

Description

The TZA3041BHL is a state-of-the-art integrated circuit (IC) from NXP Semiconductors, designed to cater to the demanding requirements of high-speed communication systems. This product is part of NXP's extensive portfolio of high-performance mixed-signal electronics that are widely used in networking, automotive, industrial, and consumer applications.

Key Features

  • High-Speed Data Transmission: The TZA3041BHL is capable of handling data rates up to 11.3 Gbps, making it suitable for various high-speed data communication protocols and applications.
  • Low Power Consumption: It is designed for energy efficiency, which is crucial for modern electronic systems, to reduce power consumption and heat generation.
  • Signal Conditioning: The device includes advanced signal conditioning features, such as pre-emphasis and equalization, to maintain signal integrity over long distances and through various transmission mediums.
  • Flexibility: With its versatile functionality, the TZA3041BHL can be used in a range of applications, including fiber optic modules, active cables, and backplane interconnects.
  • Compact Form Factor: The small form factor of the BHL package allows for integration into space-constrained applications without sacrificing performance.

Applications

The TZA3041BHL is ideal for use in a variety of high-speed communication equipment, including:

  • Data center interconnects
  • High-speed servers and routers
  • Telecommunications equipment
  • Optical transport networks
  • Enterprise networking

Technical Specifications

Some of the technical specifications of the TZA3041BHL include:

  • Supply Voltage: 3.3V
  • Operating Temperature Range: -40°C to +85°C
  • Package: BHL (Bumpless Build-Up Layer) package
  • Compliance: Meets or exceeds industry standards for high-speed data transmission

The TZA3041BHL from NXP Semiconductors represents a blend of performance, power efficiency, and design flexibility, making it an excellent choice for developers looking to create cutting-edge communication solutions.

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