The PA1315NLT is a high-performance, surface-mount power inductor manufactured by Pulse Electronics. It's engineered for a variety of power supply applications, providing efficient energy storage and filtering. Its small form factor and durable design make it ideal for use in demanding environments where space is limited.

Applications

• DC-DC converters in portable devices
• Point-of-Load (POL) regulators in servers and workstations
• Buck converters in industrial equipment
• Boost converters in LED lighting applications
• Filtering in power amplifiers

Features

• High inductance value ensuring efficient energy storage
• Low DC resistance (DCR) minimizing power loss and improving efficiency
• Surface-mount technology (SMT) for automated assembly and reduced manufacturing costs
• Compact footprint optimizing board space utilization
• Shielded construction minimizing electromagnetic interference (EMI)
• RoHS compliant, adhering to environmental regulations

Benefits

• Improved power conversion efficiency due to low DCR
• Reduced EMI emissions, ensuring compliance with regulatory standards
• Smaller and lighter designs, ideal for portable electronics
• Lower manufacturing costs through automated assembly
• Enhanced reliability due to robust construction
• Stable performance over a wide temperature range

Additional Details

The PA1315NLT inductor is constructed with a ferrite core material, which contributes to its high inductance and stable performance across varying operating conditions. The shielded design significantly reduces electromagnetic interference, making it suitable for applications where EMI compliance is critical. The surface-mount package simplifies the assembly process and allows for denser board layouts. Refer to the Pulse Electronics datasheet for detailed specifications, including inductance values, DCR, saturation current ratings, and operating temperature ranges. This inductor provides a reliable and cost-effective solution for power management, offering a balance of performance, size, and cost. It is designed to withstand reflow soldering temperatures required by modern SMT assembly processes.