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IDT5962-8855201XA

Part No IDT5962-8855201XA
Manufacturer Renesas Electronics America
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1020011-IDT5962-8855201XA
Categories OEM Parts(F-I)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian IDT5962-8855201XA CAD Model

Description

The IDT5962-8855201XA is a high-performance FIFO (First-In, First-Out) memory device manufactured by Renesas Electronics America. This component is designed for use in applications requiring asynchronous data buffering, rate matching, and data flow management. Its robust design and adherence to stringent quality standards make it suitable for demanding environments.

Applications

  • High-speed data acquisition systems
  • Digital signal processing (DSP) applications
  • Network data buffering
  • Image processing systems
  • Telecommunications equipment

Features

  • Asynchronous operation for independent read and write clocks
  • High data throughput rates
  • Low power consumption
  • Programmable flags for data management (e.g., Empty, Full, Half-Full)
  • Wide operating voltage range
  • Available in various package options for flexible integration

Benefits

  • Improved system performance through efficient data buffering
  • Reduced latency in data transfer
  • Simplified system design with integrated flag logic
  • Enhanced system reliability due to robust design and quality control
  • Increased flexibility in system architecture

Additional Details

The IDT5962-8855201XA typically supports parallel data input and output, making it easy to interface with a wide range of processors and other digital devices. The programmable flags allow for precise control over data flow, preventing data overruns and underruns. The device is often used in applications where data needs to be transferred between systems operating at different clock speeds. Its low power consumption makes it suitable for battery-powered or energy-efficient systems.

This FIFO is built to withstand extended temperature ranges, making it suitable for harsh environments. It is often available in ceramic or plastic packages, each offering different levels of robustness and cost. Its architecture ensures data integrity even under demanding operating conditions.

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