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IDT74ALVCH16276PA

Part No IDT74ALVCH16276PA
Manufacturer Renesas Electronics America
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1064580-IDT74ALVCH16276PA
Categories OEM Parts(F-I)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian IDT74ALVCH16276PA CAD Model

Description

The IDT74ALVCH16276PA is a 12-bit to 24-bit registered bus transceiver with 3-state outputs manufactured by Renesas Electronics America. This device is designed for high-speed, low-voltage operation and is typically used in applications requiring data transmission across a backplane or bus in high-performance systems. It's part of the Advanced Low-Voltage CMOS Hex Inverter (ALVCH) family, known for its low power consumption and high drive capability.

Applications:

  • Backplane data transmission
  • High-speed bus interfaces
  • Memory interface
  • Data multiplexing
  • Level translation

Features:

  • Low voltage operation: 2.3V to 3.6V
  • High-speed performance: tpd = 3.0 ns (typical)
  • 12-bit to 24-bit configuration
  • 3-state outputs
  • Bus hold on data inputs eliminates the need for external pull-up resistors
  • Latch-up performance exceeds 500mA

Benefits:

  • Improved system performance due to high-speed operation
  • Reduced power consumption, suitable for battery-powered applications
  • Flexible data transmission with 12-bit to 24-bit configuration
  • Easy interface to multiple buses with 3-state outputs
  • Enhanced system reliability due to bus hold feature

Technical Specifications:

The IDT74ALVCH16276PA operates from a low voltage supply of 2.3V to 3.6V, making it compatible with modern low-voltage logic systems. The device features a typical propagation delay of 3.0 ns, enabling high-speed data transmission. The 3-state outputs allow for multiple devices to share the same bus. The bus hold feature eliminates the need for external pull-up resistors, simplifying system design and reducing component count. The latch-up performance exceeds 500mA, ensuring robust operation in noisy environments. It is usually available in TSSOP (Thin Shrink Small Outline Package) or SOIC (Small Outline Integrated Circuit) packages. The operating temperature range is typically -40°C to +85°C.

This device is well-suited for applications requiring high-speed data transmission with low power consumption. Its flexible configuration and robust design make it a valuable component in a wide range of electronic systems.

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