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K4B2G0446QBYK0

Part No K4B2G0446QBYK0
Manufacturer Samsung
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1066655-K4B2G0446QBYK0
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4B2G0446QBYK0 CAD Model

Description

The K4B2G0446QB-YK0 is a 2Gb DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. It is designed for high-performance applications requiring fast data transfer rates and low power consumption. This memory chip is organized as 128M x 16 bits x 8 banks.

Applications

  • Desktop and laptop computers
  • Graphics cards
  • Gaming consoles
  • Networking equipment
  • High-performance embedded systems

Features

  • Capacity: 2Gb (Gigabit)
  • Organization: 128M x 16 x 8 banks
  • DDR3 interface
  • Data transfer rate: Up to 1600 Mbps
  • Operating voltage: 1.5V
  • 8 internal banks for concurrent operation
  • RoHS compliant

Benefits

  • High bandwidth: DDR3 technology provides fast data transfer rates, improving system performance.
  • Low power consumption: Operates at 1.5V, reducing energy consumption and heat generation.
  • Increased memory capacity: 2Gb of memory allows for handling large datasets and complex applications.
  • Improved system responsiveness: Fast access times and high data transfer rates result in quicker application loading and execution.
  • Reliable performance: Designed for stable and reliable operation in demanding environments.

Technical Specifications

The K4B2G0446QB-YK0 supports a clock frequency of up to 800 MHz, resulting in a data transfer rate of up to 1600 Mbps. It operates at a supply voltage of 1.5V ± 0.075V. The chip features 8 internal banks that allow for concurrent operation, improving overall memory performance. The device also includes on-chip termination (ODT) to improve signal integrity and reduce reflections on the memory bus. The operating temperature range is typically from 0°C to 85°C.

The K4B2G0446QB-YK0 is available in a 78-ball FBGA (Fine-pitch Ball Grid Array) package, which provides a compact footprint and facilitates surface mounting on printed circuit boards. The device is RoHS compliant, ensuring that it meets environmental standards for the restriction of hazardous substances.

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