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SSQ-136-21-G-D

Name: SSQ-136-21-G-D
Brand: Samtec Inc.
SKU: 1291329
Availability: InStock
Rating: 4.85 (5 reviews)

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Part No	SSQ-136-21-G-D
Manufacturer	Samtec Inc.
Catalog	Rectangular Connectors
Datasheet	SSQ-136-21-G-D Datasheet
Sample
Rohs State
ECAD Module
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Products specifications Report Issue?

Category	Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr	Samtec Inc.
Series	SSQ
Package	Bulk
Connector Type	Receptacle
Contact Type	Forked
Style	Board to Board or Cable
Number of Positions	72
Number of Positions Loaded	All
Pitch - Mating	0.100" (2.54mm)
Number of Rows	2
Row Spacing - Mating	0.100" (2.54mm)
Mounting Type	Through Hole
Termination	Solder
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Insulation Color	Black
Insulation Height	0.335" (8.51mm)
Contact Length - Post	0.104" (2.64mm)
Temperature Range - Operating	-55°C ~ 125°C
Material Flammability Rating	UL94 V-0
Contact Finish - Post	Gold
Voltage Rating	465VAC, 655VDC
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Shape	Square
Contact Material	Phosphor Bronze
Contact Finish Thickness - Post	3.00µin (0.076µm)
Base Product Number	SSQ-136
Standard Package	1
MSL Level	Not Applicable
ECCN	EAR99
HTSUS	8536.69.4040
Win Source Part Number	1291329-SSQ-136-21-G-D
Ultra Librarian 3D Model	Ultra Librarian SSQ-136-21-G-D CAD Model

Alternative Products

Description

The Samtec Inc. SSQ series connector is a rectangular receptacle connector with two rows and 72 positions.

Insulation Material: liquid crystal polymer (LCP)
Color: black
Pitch Mating: 0.100" (2.54mm)
Contact Finish Mating: gold with a thickness of 20.0µin (0.51µm)
Fastening Type: push-pull
Mounting Type: through-hole
Contact Type: forked
Contact Material: phosphor bronze
Voltage Rating: 465VAC and 655VDC
Contact Length Post: 0.104" (2.64mm)
Insulation Height: 0.335" (8.51mm)
Temperature Range: -55°C ~ 125°C
Material Flammability Rating: UL94 V-0
Application: Suitable for board to board or cable style applications

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