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Same model may have multiple batches, images only for reference.
SI53112-A00AGM Real Image
Same model may have multiple batches, images only for reference.

SI53112-A00AGM

Part No SI53112-A00AGM
Manufacturer Skyworks Solutions Inc.
Catalog Clock/Timing - Application Specific
Description IC BUFFER ZDB PCIE 1:12 64-QFN
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 25 Weeks
Features Intel QPI, PCI Express (PCIe) IC 133.33MHz Output 64-QFN (9x9)
Manufacturer Skyworks Solutions Inc.
Package Tray
Operating Temperature Range -40°C ~ 85°C
Mounting Surface Mount
Package 64-VFQFN Exposed Pad
Case / Package 64-QFN (9x9)
Family Name SI53112
MSL Level 2 (1 Year)
ECCN EAR99
HTSUS 8542.39.0001
Other Part Number SI53112-A00AGM-ND, 336-3105
Quantity per package 260
Popularity High
Supply and Demand Status Balance
Win Source Part Number 894637-SI53112-A00AGM
Ultra Librarian 3D Model Ultra Librarian SI53112-A00AGM CAD Model

Description

The Skyworks Solutions Inc. It has a balanced supply and demand status and is a part of the SI53112 family name.

  • Manufacturer: Skyworks Solutions Inc.
  • Win Source Part Number: 894637-SI53112-A00AGM
  • Package: 64-VFQFN exposed pad package
  • Operating Temperature Range: -40°C to 85°C
  • Features: Intel QPI, PCI Express (PCIe) IC 133.33MHz Output 64-QFN (9x9)
  • Estimated Production Lead Time: 25 weeks
  • Quantity per Package: 260

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