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SKY78047-12

Part No SKY78047-12
Manufacturer Skyworks Solutions Inc.
Catalog OEM Parts ( S )
Description B8, B12, B20, B26, B29, B28 + 2G LB PAiD
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Rohs State Need to verify
ECAD Module
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Win Source Part Number 1093424-SKY78047-12
Categories OEM Parts( S )
Manufacturer Skyworks Solutions Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian SKY78047-12 CAD Model

Description

The SKY78047-12 is a Multi-Mode, Multi-Band (MMMB) Front-End Module (FEM) from Skyworks Solutions Inc., designed for 4G LTE mobile devices. It integrates various functions necessary for the RF front-end, offering a compact and efficient solution for wireless communication.

Applications

  • 4G LTE Mobile Phones
  • Smartphones
  • Tablets with cellular connectivity
  • Data Cards
  • Mobile Hotspots

Features

  • Supports LTE Bands 1, 3, 7, 8, 20
  • High Efficiency Power Amplifier
  • Integrated Filters for Transmit and Receive paths
  • Low Insertion Loss
  • High Linearity
  • Small Solution Size
  • MIPI interface for control

Benefits

  • Extended battery life due to high efficiency.
  • Reduced board space requirements because of the compact design and integration.
  • Improved data transmission reliability, meeting stringent LTE standards.
  • Simplified design and manufacturing process due to the module's integrated functionality.
  • Lower overall system cost by minimizing the need for external components.

Additional Details

The SKY78047-12 integrates a power amplifier, filters, switches, impedance matching networks, and control circuitry into a single module. This integration simplifies the design process and reduces the number of external components required. It's designed to operate with a supply voltage typically in the range of 2.8 to 4.5V. The module's power control is handled through a MIPI interface, enabling precise power management and optimization for different operating modes. It also features excellent harmonic performance, ensuring compliance with regulatory requirements. The compact size makes it suitable for integration in space-constrained mobile devices. It is typically mounted using surface mount technology (SMT).

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