TE Connectivity (TE) AMPMODU 2mm Board-to-Board receptacles utilize phosphor bronze contacts with dual cantilever beams that are available in available in three gold plating options. The dual-beam design provides for an increased contact surface between the header pin and the receptacle contact to allow reliable signal transfer. Housed in a high-temperature-resistant liquid crystal polymer (LCP) plastic, receptacles can be applied in automated surface-mount, through-hole-reflow (Pin-inPaste) and traditional through-hole mount processes. The complete portfolio includes various top- and dual-entry vertical and horizontal receptacles that offer multiple options for Board-to-Board stacking of header and receptacle combinations.