The TC74HC08FT is a high-speed CMOS logic quad 2-input AND gate from Toshiba's TC74HC series. This device utilizes silicon gate CMOS technology to achieve high-speed operation similar to equivalent bipolar Schottky TTL devices, while maintaining the low power consumption characteristic of CMOS integrated circuits. It provides four independent two-input AND gates in a single package.

Applications

• General purpose logic applications
• Digital circuits
• Microcomputer systems
• Data processing
• Control systems
• Signal gating

Features

• High-speed operation: tpd = 7ns (typ.) at VCC = 5V
• Low power dissipation: ICC = 1μA (max.) at Ta = 25°C
• High noise immunity: VNIH = VNIL = 28 % VCC (min.)
• Output drive capability: 10 LSTTL loads
• Symmetrical output impedance: |IOH| = IOL = 4mA (min.)
• Wide operating voltage range: VCC = 2V to 6V
• Pin and function compatible with 74LS08

Benefits

• Increased system speed due to fast propagation delay.
• Reduced power consumption leading to energy efficiency and longer battery life in portable applications.
• Improved noise immunity, ensuring reliable operation in noisy environments.
• Direct interface with TTL circuits, simplifying system design.
• Simplified system design due to pin compatibility with standard logic devices.
• Versatile application due to the wide operating voltage range.

Additional Details

The TC74HC08FT comes in a TSSOP14 (Thin Shrink Small Outline Package) and operates over a wide temperature range. Each AND gate performs the logical AND function: the output is HIGH only when both inputs are HIGH; otherwise, the output is LOW. The device's symmetrical output drive capability ensures balanced sourcing and sinking current, making it suitable for driving various loads. The high noise immunity levels guarantee reliable operation even in environments with significant electrical noise. The wide operating voltage range provides flexibility in various applications and power supply configurations. The low power consumption allows for dense packaging and reduces heat dissipation, making it suitable for compact and battery-powered devices. The smaller TSSOP package allows for higher density board layouts.