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SI5908DC-T1-E3

Part No SI5908DC-T1-E3
Manufacturer Vishay
Catalog Transistors - FETs, MOSFETs - RF
Description MOSFET 2N-CH 20V 4.4A 1206-8
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Discrete Semiconductor Products
Manufacturer Vishay
Packaging Reel - TR
Status Active
FET Type 2 N-Channel (Dual)
FET Feature Logic Level Gate
Drain-Source Breakdown Voltage 20V
Continuous Drain Current at 25°C 4.4A
Maximum Rds On at Id,Vgs 40 mOhm @ 4.4A, 4.5V
Gate-Source Threshold Voltage 1V @ 250μA
Max Gate Charge 7.5nC @ 4.5V
Maximum Power Dissipation 1.1W
Temperature Range - Operating -55°C to 150°C (TJ)
Mounting SMD (SMT)
Case / Package 1206-8 ChipFET
Win Source Part Number 028583-SI5908DC-T1-E3
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian SI5908DC-T1-E3 CAD Model

Description

The SI5908DC-T1-E3 is a P-Channel MOSFET manufactured by Vishay. It is commonly used in load switching and power management applications within portable devices and other electronic systems. This MOSFET benefits from low on-resistance and a small form factor, making it ideal for space-constrained applications requiring efficient power control.

Applications:

  • Load Switching: Used for efficient power switching to various loads in portable electronic devices.
  • Power Management: Employed in DC-DC converters and power regulation circuits to manage power distribution effectively.
  • Battery Management Systems (BMS): Integrated into battery charging and discharging circuits to optimize battery performance.
  • Portable Electronics: Commonly found in smartphones, tablets, wearables, and other battery-powered devices requiring efficient power management.

Features:

  • Low On-Resistance (RDS(on)): Reduces power loss and improves overall efficiency, extending battery life.
  • Low Gate Threshold Voltage (VGS(th)): Enables easy driving from low-voltage logic circuits, simplifying circuit design.
  • Small Footprint: Housed in a compact PowerPAK SC-70 package, saving valuable board space and allowing for higher circuit density.
  • TrenchFET® Power MOSFET Technology: Provides superior switching performance and high power density.
  • RoHS Compliant: Meets environmental regulations for hazardous substance content, ensuring responsible usage and disposal.

Benefits:

  • Enhanced Efficiency: Low RDS(on) minimizes power dissipation, contributing to longer battery life in portable devices.
  • Simplified Design: Low VGS(th) simplifies gate drive requirements, reducing component count and complexity.
  • Space Savings: Compact package enables high-density circuit board layouts, maximizing space utilization.
  • Improved Thermal Performance: Efficient heat dissipation due to low RDS(on), enhancing reliability and longevity.
  • Environmentally Friendly: RoHS compliance ensures responsible disposal and minimizes environmental impact.

Additional Details:

The SI5908DC-T1-E3 is typically supplied in tape and reel packaging (T1) for automated assembly. The 'E3' suffix indicates compliance with RoHS (Restriction of Hazardous Substances) standards. Key electrical characteristics include drain-source voltage (VDS), gate-source voltage (VGS), continuous drain current (ID), and pulsed drain current (IDM). The RDS(on) is a critical parameter influenced by VGS and temperature, significantly affecting power dissipation. Consult the Vishay datasheet for the SI5908DC-T1-E3 for comprehensive specifications and application guidelines.

Effective PCB layout is essential for optimizing heat dissipation. Adhering to the absolute maximum ratings is critical to ensure reliable operation and prevent device failure.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $20.3731 $61.1193
6+ $16.7164 $100.2984
10+ $16.1941 $161.9410
13+ $15.6717 $203.7321
17+ $15.1493 $257.5381
23+ $13.5821 $312.3883
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Availability: 28,000 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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