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SI9400DY-T1-E3

Part No SI9400DY-T1-E3
Manufacturer Vishay
Catalog OEM Parts ( S )
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1093007-SI9400DY-T1-E3
Categories OEM Parts( S )
Manufacturer Vishay
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian SI9400DY-T1-E3 CAD Model

Description

The SI9400DY-T1-E3 is an N-channel MOSFET manufactured by Vishay. It's designed for power switching applications where efficiency and low on-resistance are critical.

Applications:

  • DC-DC converters: Used as a switching element in step-up (boost) and step-down (buck) converters.
  • Load switching: Controlling power to various loads in electronic circuits.
  • Motor control: Switching power to small DC motors.
  • Power management: Used in power management circuits for portable devices and other battery-powered equipment.

Features:

  • N-channel MOSFET: Offers efficient switching performance.
  • Low on-resistance (RDS(on)): Minimizes power loss during conduction.
  • Fast switching speed: Enables high-frequency operation.
  • Surface mount package: Allows for efficient PCB assembly.
  • TrenchFET® Power MOSFET: Utilizes advanced trench technology for improved performance.

Benefits:

  • High efficiency: Low on-resistance minimizes power loss, resulting in efficient power conversion.
  • Fast switching: Enables high-frequency operation, reducing the size of passive components.
  • Compact design: Surface mount package saves board space.
  • Improved thermal performance: Efficient heat dissipation for reliable operation.

Additional Details:

The SI9400DY-T1-E3 is characterized by its low gate charge and fast switching speed, making it suitable for high-frequency applications. The 'T1' likely indicates a specific tape and reel packaging for automated assembly. The 'E3' indicates lead-free construction. Consult the device datasheet for detailed electrical specifications, including drain-source voltage, gate-source voltage, drain current, and on-resistance characteristics at different gate voltages and temperatures. Proper gate drive circuitry is essential for achieving optimal switching performance. Heat sinking may be required depending on the power dissipation in the application. Careful PCB layout is necessary to minimize parasitic inductance and optimize switching performance.

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