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Same model may have multiple batches, images only for reference.
W632GG6NB09J Real Image
Same model may have multiple batches, images only for reference.

W632GG6NB09J

Part No W632GG6NB09J
Manufacturer Winbond Electronics
Catalog Memory
Description IC DRAM 2GBIT PAR 96VFBGA
Datasheet
W632GG6NB09J Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Winbond Electronics
Package Tray
Product Status Active
Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 1.067 GHz
Write Cycle Time - Word, Page 15ns
Access Time 20 ns
Voltage - Supply 1.425V ~ 1.575V
Temperature Range - Operating -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Base Product Number W632GG6
Standard Package 198 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Win Source Part Number 941413-W632GG6NB09J
Ultra Librarian 3D Model Ultra Librarian W632GG6NB09J CAD Model

Description

The 941413-W632GG6NB09J is an integrated circuit memory module designed for use in electronic devices.

  • Category: Integrated Circuits (ICs) - Memory - Memory
  • Technology: SDRAM - DDR3
  • Memory Size: 2Gbit
  • Clock Frequency: 1.067 GHz
  • Access Time: 20 ns
  • Voltage Supply: 1.425V to 1.575V
  • Mounting Type: Surface Mount
  • Package: 96-VFBGA
  • Temperature Range: -40°C to 105°C (TC)
  • Memory Format: DRAM
  • Memory Interface: Parallel
  • Base Product Number: Winbond Electronics W632GG6
  • Product Status: Active
  • REACH: Unaffected
  • Memory Organization: 128M x 16

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