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XC7A75T-2FGG676C

Part No XC7A75T-2FGG676C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 300 I/O 676FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 676-BGA
Manufacturer Xilinx Inc.
Series Artix-7
Package Tray
Number of I/O 300
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 676-BGA
Case / Package 676-FBGA (27x27)
Family Name XC7A75
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 40
Popularity High
Supply and Demand Status Balance
Win Source Part Number 903862-XC7A75T-2FGG676C
Ultra Librarian 3D Model Ultra Librarian XC7A75T-2FGG676C CAD Model

Description

The XC7A75T-2FGG676C is an Artix-7 FPGA from Xilinx, designed for a wide range of applications that require high performance and low power consumption. The Artix-7 family is known for its cost-optimized architecture and efficient use of resources.

Applications

  • Industrial Automation: Used in motor control, robotics, and industrial networking.
  • Automotive: Employed in advanced driver-assistance systems (ADAS) and infotainment systems.
  • Video Processing: Utilized in video surveillance, machine vision, and video conferencing.
  • Wireless Communications: Found in software-defined radios (SDR) and other wireless communication systems.
  • Medical Devices: Used in portable medical imaging and diagnostic equipment.

Features

  • Logic Cells: Contains a substantial number of logic cells for implementing complex digital circuits.
  • Block RAM: Features on-chip Block RAM for high-speed data storage.
  • DSP Slices: Integrated DSP slices enable efficient implementation of digital signal processing algorithms.
  • High-Speed I/O: Supports a wide range of I/O standards for interfacing with various external devices.
  • Power Management: Offers power management features for minimizing power consumption.
  • FGG676 Package: Offered in a 676-pin Fine-Pitch Ball Grid Array (FGG676) package.
  • -2 Speed Grade: Indicates a specific speed grade within the Artix-7 family, allowing for performance optimization.

Benefits

  • High Performance: Provides high-speed logic and signal processing capabilities for various applications.
  • Low Power Consumption: Efficient architecture minimizes power consumption.
  • Cost-Optimized: Offers a balance of performance and cost for a wide range of applications.
  • Flexibility: Programmable logic allows for customization and adaptation to specific application requirements.
  • Reduced Time-to-Market: Development tools and IP cores enable faster design and implementation.

Additional Details

The XC7A75T-2FGG676C is fabricated using a 28nm process technology. It supports various memory interfaces, including DDR3. The device is supported by Xilinx's Vivado Design Suite for design entry, simulation, and implementation. It operates over a commercial temperature range, indicated by the 'C' in the part number. The Artix-7 family includes features such as partial reconfiguration and integrated analog-to-digital converters (ADCs). It offers a good balance between cost and performance for a variety of applications, making it a popular choice in the embedded systems market. Includes integrated PCIe endpoint capability.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $63.0692 $63.0692
2+ $51.7491 $103.4982
3+ $50.1320 $150.3960
5+ $48.5148 $242.5740
6+ $46.8977 $281.3862
8+ $42.0462 $336.3696
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 2,000 pieces
Order Increment : 1 pcs
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