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Same model may have multiple batches, images only for reference.
XCKU3P-L2FFVB676E Real Image
Same model may have multiple batches, images only for reference.

XCKU3P-L2FFVB676E

Part No XCKU3P-L2FFVB676E
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 280 I/O 676FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 280 31641600 355950 676-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer AMD Xilinx
Packaging Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 280
Voltage - Supply 0.698V ~ 0.876V
Mounting Surface Mount
Temperature Range - Operating 0°C ~ 100°C (TJ)
Case / Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
ECCN 5A002A1
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1323261-XCKU3P-L2FFVB676E
Ultra Librarian 3D Model Ultra Librarian XCKU3P-L2FFVB676E CAD Model

Description

The AMD Xilinx 1323261-XCKU3P-L2FFVB676E is an FPGA (Field Programmable Gate Array) integrated circuit that is surface mounted and packaged in a tray.

  • LABs/CLBs: 20340
  • Logic Elements/Cells: 355950
  • I/Os: 280
  • Voltage Supply: 0.698V ~ 0.876V
  • Total RAM: 31641600 bits
  • Temperature Range: 0°C ~ 100°C (TJ)
  • Package: 676-FCBGA (27x27)
  • ECCN: 5A002A1
  • ROHS3 Compliance: ROHS3 compliant

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