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CS0805-R33G-S

Part No CS0805-R33G-S
Manufacturer Chilisin
Catalog OEM Parts (C - E)
Description CS0805 330NH 310MA 2% Wwt
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 983998-CS0805-R33G-S
Categories OEM Parts(C-E)
Manufacturer Chilisin
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CS0805-R33G-S CAD Model

Description

The CS0805-R33G-S is a chip inductor manufactured by Chilisin. It belongs to the CS series of inductors and is designed for use in various electronic circuits requiring inductance for filtering, tuning, or impedance matching. Its small size and high performance make it suitable for a wide range of applications.

Applications

  • RF circuits
  • Mobile phones
  • Wireless communication devices
  • Bluetooth devices
  • GPS devices
  • LC resonant circuits
  • Impedance matching circuits

Features

  • Compact 0805 package size (0.08 inch x 0.05 inch)
  • High Q value
  • Tight inductance tolerance
  • Excellent self-resonant frequency (SRF)
  • Wire-wound construction
  • RoHS compliant

Benefits

  • Space-saving design ideal for compact devices
  • Efficient signal filtering and tuning due to high Q
  • Precise inductance value for reliable performance
  • Suitable for high-frequency applications
  • Durable and reliable performance
  • Environmentally friendly

Specifications

The CS0805-R33G-S has an inductance of 0.33 μH (microhenries). It features a tight tolerance, ensuring accurate inductance value. The inductor is designed for surface mount technology (SMT) assembly. The operating temperature range is typically -55°C to +125°C. The 'G' in the part number usually indicates the tolerance, often around 2% or 5%.

The wire-wound construction ensures good performance at high frequencies. The CS0805-R33G-S inductor is used in applications that demand both compactness and stable electrical characteristics. It finds its application particularly in RF impedance matching and filter networks. Its small footprint allows it to be placed in densely populated PCB assemblies without significantly impacting the size of the final device.

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Shipping Information

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