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CY62137VLL-70BAI

Part No CY62137VLL-70BAI
Manufacturer Cypress Semiconductor Corp
Catalog Memory
Description IC SRAM 2MBIT PARALLEL 48FBGA / SRAM - Asynchronous Memory IC 2Mbit Parallel 70 ns 48-FBGA (7x7)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Cypress Semiconductor Corp
Series MoBL®
Package Bulk
Product Status Active
Programmable Not Verified
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 2Mbit
Memory Organization 128K x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 70ns
Access Time 70 ns
Voltage - Supply 2.7V ~ 3.6V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFBGA
Supplier Device Package 48-FBGA (7x7)
Base Product Number CY62137
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Affected
ECCN 3A991B2A
HTSUS 8542.32.0041
Win Source Part Number 102424-CY62137VLL-70BAI
Ultra Librarian 3D Model Ultra Librarian CY62137VLL-70BAI CAD Model

Description

CY62137VLL-70BAI Overview

The CY62137VLL-70BAI extends the capabilities of its base model with an enhanced industrial temperature range. This makes it a perfect fit for demanding industrial applications where environmental conditions can vary widely.

Applications

  • Robust industrial systems
  • Complex automotive applications
  • Advanced telecommunications equipment
  • Rugged consumer electronics
  • Mission-critical embedded systems

Features and Benefits

  • Fast 70 ns access time for reliable high-speed data retrieval.
  • Operates over a wide temperature range from -40°C to 85°C, ideal for industrial use.
  • Low power consumption profile, sustaining continuous operation.
  • Operates between 2.7V and 3.6V voltage range.
  • Offered in compact and flexible 32-TSOP I and 32-SOJ packages.

Additional Information

The CY62137VLL-70BAI is engineered to handle tougher environments without compromising on performance, thereby supporting diverse and challenging application needs effectively.

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