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CY7C1318BV18-167BZC

Part No CY7C1318BV18-167BZC
Manufacturer Cypress Semiconductor Corp
Catalog OEM Souring
Description 18-Mbit DDR-II SRAM 2-Word FBGA-165
Sample
Rohs State Need to verify
ECAD Module
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Category OEM Souring
Win Source Part Number 1465385-CY7C1318BV18-167BZC
Manufacturer Cypress Semiconductor Corp
Package Tray;Tray
Product Status Obsolete
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Synchronous, DDR II
Memory Size 18Mbit
Memory Organization 1M x 18
Memory Interface Parallel
Clock Frequency 167MHz
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 70°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 165-LBGA
Supplier Device Package 165-FBGA (13x15)
Ultra Librarian 3D Model Ultra Librarian CY7C1318BV18-167BZC CAD Model

Description

Cypress introduces the CY7C1318BV18-167BZC, an 18-Mbit DDR-II SRAM with a 2-Word Burst architecture, enveloped in an advanced FBGA-165 package. This IC is engineered to meet the high-performance requirements of the most demanding data processing environments. Offering the perfect blend of speed, reliability, and capacity, it is designed for applications that cannot afford to compromise on data integrity and rapid access speeds. Suitable for networking, high-performance computing, and telecommunications equipment, this SRAM provides solutions to the challenges of managing large volumes of data under tight performance specifications. With Cypress's commitment to quality and advancement, the CY7C1318BV18-167BZC represents a pinnacle in memory component design, providing system designers and engineers with a resource to significantly enhance system efficiency, reliability, and performance.

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