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CY7C1393AV18-167BZC

Part No CY7C1393AV18-167BZC
Manufacturer Cypress Semiconductor Corp
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1031559-CY7C1393AV18-167BZC
Categories OEM Parts(C-E)
Manufacturer Cypress Semiconductor Corp
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CY7C1393AV18-167BZC CAD Model

Description

The CY7C1393AV18-167BZC is a high-speed, synchronous pipelined burst SRAM (Static Random Access Memory) from Cypress Semiconductor. It is designed for applications that require fast data access and high bandwidth, such as networking, telecommunications, and high-performance computing.

Applications:

  • Networking Equipment: Routers, switches, and other networking devices require high-speed memory for packet buffering and forwarding.
  • Telecommunications Systems: Used in base stations, wireless communication systems, and other telecommunications equipment for data storage and processing.
  • High-Performance Computing: Servers, workstations, and other high-performance computing systems utilize this SRAM for cache memory and other high-speed data storage applications.
  • Data Acquisition Systems: Instruments, data loggers, and other data acquisition systems rely on fast memory for capturing and storing data.
  • Medical Imaging: Medical imaging equipment, such as MRI and CT scanners, uses high-speed memory for image processing and storage.

Features:

  • High Speed: Offers a clock rate of 167 MHz for fast data access.
  • Synchronous Operation: Synchronous design simplifies timing and control.
  • Pipelined Burst Architecture: Pipelined burst architecture enables high data throughput.
  • 18-Bit Data Bus: Supports an 18-bit data bus for high-bandwidth data transfer.
  • 2Mb Density: Provides a memory density of 2Mb.
  • Voltage: Operates at 1.8V, which helps minimize power consumption.
  • Package: Available in a BGA (Ball Grid Array) package for surface mount assembly.

Benefits:

  • Increased Throughput: High clock speed and pipelined burst architecture enable high data throughput.
  • Reduced Latency: Fast access times reduce latency in critical applications.
  • Simplified System Design: Synchronous operation simplifies system design and timing.
  • Lower Power Consumption: Low voltage operation reduces power consumption and heat dissipation.
  • Enhanced System Performance: High-speed memory enhances overall system performance.

Additional Details:

The CY7C1393AV18-167BZC utilizes a 1.8V power supply and is available in a BGA package for high-density board mounting. Detailed specifications including timing characteristics, power consumption details, and package dimensions are available in the Cypress Semiconductor datasheet. This SRAM is specifically designed for applications demanding very fast memory access and high bandwidth.

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