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Same model may have multiple batches, images only for reference.
CY7C2165KV18-550BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C2165KV18-550BZXC

Part No CY7C2165KV18-550BZXC
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 18MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, QDR II+ Memory IC 18Mb (512K x 36) Parallel 550 MHz 165-FBGA (13x15)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range 0°C ~ 70°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (13x15)
Family Name CY7C2165
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Quantity per package 136
Popularity High
Supply and Demand Status Balance
Win Source Part Number 916458-CY7C2165KV18-550BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C2165KV18-550BZXC CAD Model

Description

The CY7C2165KV18-550BZXC is a high-speed synchronous SRAM memory IC with a capacity of 18Mb (512K x 36).

  • Manufacturer: Cypress Semiconductor Corp.
  • Package: 165-FBGA (13x15)
  • Operating Temperature: 0°C to 70°C (TA)
  • Interface: Parallel interface that operates @ 550 MHz
  • Type: QDR II+ memory IC
  • Application: Ideal for use in applications that require high-speed data transfer
  • Category: Integrated circuits (ICs)
  • Popularity: Popular choice among designers and manufacturers
  • Supply and Demand: Balance of supply and demand status
  • REACH: Unaffected by REACH
  • Lead Time: Estimated production lead time is 39 weeks.

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