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FP75R12KT3

Part No FP75R12KT3
Manufacturer eupec GmbH
Catalog IGBTs - Modules
Description IGBT-inverter
Sample
Rohs State rohs
ECAD Module
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Manufacturer eupec GmbH
Win Source Part Number 1175115-FP75R12KT3
Manufacturer Homepage www.eupec.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian FP75R12KT3 CAD Model

Description

The FP75R12KT3 is an IGBT module manufactured by eupec GmbH (now Infineon Technologies). It is a high-power, high-performance insulated gate bipolar transistor (IGBT) module designed for various power electronics applications. This module offers efficient switching characteristics and robust construction, making it suitable for demanding industrial environments.

Applications

  • AC motor drives: Used in variable frequency drives (VFDs) for controlling the speed and torque of AC motors.
  • Uninterruptible power supplies (UPS): Provides reliable power backup in case of main power failures.
  • Welding equipment: Used in inverter-based welding machines for efficient power conversion.
  • Renewable energy systems: Used in solar inverters and wind turbine converters for grid connection.
  • Traction drives: Used in electric vehicles and railway applications for motor control.

Features

  • High blocking voltage: 1200V blocking voltage capability.
  • Low saturation voltage: Reduces conduction losses and improves efficiency.
  • Fast switching speed: Enables high-frequency operation and reduces switching losses.
  • Integrated temperature sensor: Allows for precise temperature monitoring and control.
  • Isolated baseplate: Provides electrical isolation between the module and the heatsink.
  • Robust design: Withstands harsh operating conditions and offers long-term reliability.

Benefits

  • Improved energy efficiency: Low losses contribute to higher overall system efficiency.
  • Reduced system size and weight: Compact module design allows for smaller and lighter inverter designs.
  • Increased reliability: Robust design and integrated protection features enhance system reliability.
  • Simplified system design: Integrated features simplify the design and implementation of power electronic systems.
  • Enhanced thermal performance: Efficient heat dissipation ensures reliable operation at high power levels.

Technical Specifications: The FP75R12KT3 module typically features a collector current (Ic) of around 75A at 25°C, a gate-emitter voltage (Vge) of ±20V, and an operating junction temperature (Tj) of -40°C to +150°C. It is typically housed in a standard EconoPACK™ package for ease of mounting and thermal management. The module incorporates an NTC temperature sensor for monitoring the chip temperature, which is vital for preventing thermal runaway and ensuring safe operation. The internal structure usually contains IGBT chips and free-wheeling diodes optimized for fast switching and low losses.

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