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RFD3055LESM9A7899

Part No RFD3055LESM9A7899
Manufacturer Fairchild/ON Semiconductor
Catalog OEM Parts (O - R)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1088193-RFD3055LESM9A7899
Categories OEM Parts(O-R)
Manufacturer Fairchild/ON Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian RFD3055LESM9A7899 CAD Model

Description

The RFD3055LESM9A7899 is an N-Channel enhancement mode power MOSFET from ON Semiconductor (formerly Fairchild Semiconductor). It's designed to provide efficient power switching in various applications through its low on-state resistance and fast switching capabilities. This MOSFET utilizes advanced PowerTrench® technology.

Applications:

  • DC-DC converters
  • Power management in portable devices
  • Load switching applications
  • Battery charging circuits
  • LED lighting

Features:

  • Low gate charge (Qg): Reduces switching losses and improves efficiency.
  • Low on-resistance (RDS(on)): Minimizes conduction losses for high efficiency.
  • Fast switching speed: Enables high-frequency operation.
  • 100% avalanche tested: Guarantees robustness and reliability under avalanche conditions.
  • RoHS compliant: Ensures environmental compliance.

Benefits:

  • Improved system efficiency: Low on-resistance and gate charge result in reduced power losses.
  • Extended battery life: Ideal for portable devices due to minimized power consumption.
  • Enhanced reliability: Avalanche testing ensures ruggedness and longevity.
  • Simplified thermal management: Lower power dissipation reduces heat generation.
  • Compact design: Suitable for space-constrained applications.

Additional Details:

The RFD3055LESM9A7899 features a drain-source voltage (VDSS) of 60V and a continuous drain current (ID) that supports a variety of power applications. Its low on-resistance (RDS(on)) minimizes power dissipation, crucial for efficiency. It is designed for optimal performance in synchronous rectification and other high-frequency switching applications. The specific package is designed for surface mounting, optimizing board space. The device is engineered to be easily driven by standard logic-level signals, streamlining integration into different electronic systems.

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