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6MBP20VSC-060-50-P

Part No 6MBP20VSC-060-50-P
Manufacturer Fuji Electric
Catalog Custom Parts (0 - A)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1197983-6MBP20VSC-060-50-P
Categories Custom Parts
Manufacturer Fuji Electric
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 6MBP20VSC-060-50-P CAD Model

Description

The 6MBP20VSC-060-50-P is an IPM (Intelligent Power Module) manufactured by Fuji Electric. It integrates multiple power semiconductor devices and control circuits into a single package, simplifying power inverter designs.

Applications

  • Air conditioners
  • Washing machines
  • Industrial motor drives
  • Servo systems
  • General-purpose inverters

Features

  • Integrated Gate Drivers: Simplifies the design and reduces external component count.
  • Short-Circuit Protection: Protects the module from damage due to short-circuit events.
  • Over-Temperature Protection: Prevents overheating and ensures reliable operation.
  • Under-Voltage Lockout: Prevents operation with insufficient voltage supply, protecting the module.
  • Low Switching Losses: Improves efficiency and reduces heat generation.

Benefits

  • Simplified Design: Integrated functions reduce design complexity and component count.
  • Enhanced Reliability: Built-in protection features enhance system reliability.
  • Improved Efficiency: Low switching losses contribute to higher energy efficiency.
  • Compact Size: Integration reduces the overall size of the power inverter.
  • Easy to Use: Simplified interface and control signals facilitate easy integration into various applications.

Additional Details

The 6MBP20VSC-060-50-P typically features a voltage rating of 600V and a current rating of 20A. It includes IGBTs (Insulated Gate Bipolar Transistors) for power switching and diodes for freewheeling. The module is designed to operate at switching frequencies up to several kHz. The integrated protection circuits ensure that the module can withstand abnormal operating conditions, making it a robust solution for demanding applications. The package is designed for easy mounting and thermal management, ensuring efficient heat dissipation.

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