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880\GM71VS65163CLT-50

Part No 880\GM71VS65163CLT-50
Manufacturer Hynix Semiconductor
Catalog Unclassified Memory
Description EDO 4Mx16-50 3.3 4K TSOP
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Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 944424-880\GM71VS65163CLT-50
Series *
Ultra Librarian 3D Model Ultra Librarian 880\GM71VS65163CLT-50 CAD Model

Description

The GM71VS65163CLT-50 is a 1M x 16-bit synchronous high data rate (HDR) CMOS Static RAM (SRAM) manufactured by Hynix Semiconductor. This SRAM is designed for applications requiring high-speed data access and storage, such as networking equipment, telecommunications systems, and high-performance computing.

Applications:

  • Networking Equipment (Routers, Switches)
  • Telecommunications Systems
  • High-Performance Computing
  • Cache Memory
  • Digital Signal Processing (DSP) Systems

Features:

  • High-Speed Data Access: Synchronous operation enables fast data transfer rates.
  • 1M x 16-bit Organization: Provides a large memory capacity with a 16-bit data bus.
  • CMOS Technology: Offers low power consumption.
  • High Data Rate (HDR): Supports high-speed data transfer for demanding applications.
  • 50 MHz Clock Frequency: Designed for systems requiring high-speed memory access.

Benefits:

  • Increased System Performance: High-speed data access improves overall system performance in networking and computing applications.
  • Low Power Consumption: CMOS technology minimizes power usage, making it suitable for power-sensitive applications.
  • Large Memory Capacity: 1M x 16-bit organization provides ample memory space for data storage and processing.
  • Reliable Data Storage: SRAM technology ensures reliable data retention.
  • Versatile Usage: Suitable for a wide range of high-speed memory applications.

Technical Specifications:

The GM71VS65163CLT-50 typically operates at a 50 MHz clock frequency with a supply voltage of 3.3V. It features synchronous data access, meaning data transfers are synchronized with the clock signal. The SRAM is designed with CMOS technology for low power consumption and high-speed operation. It is generally available in a surface-mount package such as a TQFP (Thin Quad Flat Pack) to allow for efficient board-level assembly.

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