The H5TC2G43CFR-PBA is a 2Gb DDR3 SDRAM (Double Data Rate Three Synchronous Dynamic Random-Access Memory) component from Hynix Semiconductor. This chip is designed to provide high-speed memory access for various applications, leveraging the DDR3 architecture to achieve improved bandwidth and lower power consumption compared to previous DDR generations.

Applications

• Desktop and laptop computers
• Graphics cards
• Gaming consoles
• Networking equipment
• Embedded systems

Features

• Capacity: 2Gb (256M x 8)
• DDR3: Double Data Rate Three architecture for enhanced performance
• Data Transfer Rate: Supports data transfer rates up to 1600 MHz (depending on the specific speed grade)
• Clock Frequency: Typically operates with a clock frequency up to 800 MHz (for a 1600 MHz data rate)
• Interface: Industry-standard DDR3 interface
• Power Supply: Operates at 1.5V, reducing power consumption compared to DDR2
• Package: FBGA (Fine-Pitch Ball Grid Array) package
• RoHS Compliant: Lead-free and compliant with RoHS environmental standards

Benefits

• High Bandwidth: DDR3 technology significantly increases memory bandwidth, enabling faster data processing and improved system responsiveness.
• Increased Memory Capacity: The 2Gb capacity allows for storing and processing large amounts of data, suitable for demanding applications.
• Lower Power Consumption: Operates at a lower voltage (1.5V) compared to DDR2, resulting in reduced power consumption and heat generation.
• Easy Integration: The standard DDR3 interface simplifies integration into existing systems and designs.
• Improved Performance: Offers enhanced performance compared to DDR2, leading to overall system improvements.

Additional Details

The H5TC2G43CFR-PBA is commonly used in applications that require fast and efficient memory access, such as high-performance computing, gaming, and multimedia processing. The DDR3 architecture, combined with its clock speed and capacity, makes it suitable for demanding tasks. The FBGA package enables efficient heat dissipation and allows for high-density board designs. Understanding the timing parameters, such as CAS latency (CL), and other DDR3-specific parameters is important for optimizing memory performance in specific applications. Refer to the Hynix datasheet for detailed specifications and timing diagrams to ensure proper implementation and optimal performance. The -PBA likely indicates a specific speed grade or timing configuration.