The Inpaq WIP252010S-1R0ML is a shielded wire-wound power inductor designed for a wide range of power management applications. This inductor features a compact 2520 (2.5mm x 2.0mm) footprint and a low profile, making it suitable for space-constrained applications. The shielded construction minimizes electromagnetic interference (EMI). It offers excellent current handling capability and low DC resistance, contributing to efficient power conversion.

Applications:

• DC-DC Converters
• Power Supplies
• Point-of-Load (POL) Regulators
• Smartphones
• Tablets
• Wearable Devices

Features:

• Compact Size: 2520 (2.5mm x 2.0mm) footprint for space-constrained applications.
• Low Profile: Minimizes component height for slim designs.
• Shielded Construction: Reduces electromagnetic interference (EMI).
• Wire-Wound Construction: Provides excellent current handling capability.
• Low DC Resistance (DCR): Minimizes power losses and improves efficiency.
• High Saturation Current: Allows for stable inductance under high current conditions.
• Operating Temperature Range: Wide operating temperature range for reliable performance in various environments.

Benefits:

• Space Saving: Compact size and low profile enable miniaturization of electronic devices.
• High Efficiency: Low DCR minimizes power losses, improving overall system efficiency.
• Stable Performance: High saturation current ensures stable inductance under high current conditions.
• Reduced EMI: Shielded construction minimizes electromagnetic interference, improving system reliability.
• Wide Operating Temperature Range: Ensures reliable performance in a variety of environments.
• Easy to Integrate: Surface mount design simplifies assembly and integration.
• Cost-Effective Solution: Provides a high-performance inductor at a competitive price.

Additional Details:

The Inpaq WIP252010S-1R0ML has an inductance value of 1.0 μH. It is designed to meet stringent regulatory requirements and is suitable for use in a wide range of power management applications. The inductor is available in tape and reel packaging for automated assembly. The shielded construction makes it particularly suitable for use in sensitive electronic devices where EMI needs to be minimized.