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Same model may have multiple batches, images only for reference.
EP3C55F484C6 Real Image
Same model may have multiple batches, images only for reference.

EP3C55F484C6

Part No EP3C55F484C6
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 327 I/O 484FBGA
Datasheet
EP3C55F484C6 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 45 Weeks
Features series Field Programmable Gate Array (FPGA) IC 327 2396160 55856 484-BGA
Manufacturer Intel
Series Cyclone® III
Package Tray
Number of I/O 327
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 484-BGA
Case / Package 484-FBGA (23x23)
Family Name EP3C55
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number -544-2505, 972393, 544-2505
Quantity per package 60
Popularity High
Supply and Demand Status Balance
Win Source Part Number 918281-EP3C55F484C6
Ultra Librarian 3D Model Ultra Librarian EP3C55F484C6 CAD Model

Description

The Intel EP3C55F484C6 is a part of the Cyclone® III series and is a field programmable gate array (FPGA) IC.

  • Series: Cyclone® III
  • Operating Temperature: 0°C to 85°C
  • I/O: 327
  • Package: 484-BGA
  • Mounting: surface mount technology
  • Popularity: high
  • Supply and Demand Status: balanced
  • Package Quantity: 60
  • MSL Level: 3 (168 hours)
  • Production Lead Time: 45 weeks
  • REACH Status: REACH unaffected
  • HTSUS Code: 8542.39.0001
  • Other Part Numbers: -544-2505, 972393, and 544-2505

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