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IS61WV12816EDBLL-8TLI

Part No IS61WV12816EDBLL-8TLI
Manufacturer ISSI, Integrated Silicon Solution Inc
Catalog OEM Parts (F - I)
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Rohs State Need to verify
ECAD Module
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Win Source Part Number 1017165-IS61WV12816EDBLL-8TLI
Categories OEM Parts(F-I)
Manufacturer ISSI, Integrated Silicon Solution Inc
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian IS61WV12816EDBLL-8TLI CAD Model

Description

The IS61WV12816EDBLL-8TLI is a high-speed, low-power synchronous static random-access memory (SSRAM) from ISSI (Integrated Silicon Solution Inc.). This memory chip features a 128K x 16-bit organization, providing a total memory capacity of 2 Megabits. It is designed for applications requiring fast data access and low power consumption, making it suitable for various embedded systems and high-performance computing devices.

Applications:

  • Networking equipment (routers, switches)
  • Telecommunications systems
  • Industrial control systems
  • Medical devices
  • Automotive electronics
  • High-performance embedded systems

Features:

  • High-speed synchronous operation: 133 MHz clock frequency
  • Low power consumption: Active current 120mA (typical), standby current 10mA (typical)
  • 128K x 16-bit organization
  • Single 3.3V power supply
  • LVTTL-compatible inputs and outputs
  • Byte Write (BW) control
  • Global Write enable
  • ZZ mode for automatic power-down
  • Available in a 48-ball FBGA package

Benefits:

  • Fast data access: Synchronous operation enables high-speed data transfer.
  • Low power consumption: Reduces overall system power requirements, suitable for battery-powered applications.
  • High memory capacity: 2 Megabits of memory in a compact package.
  • Easy integration: LVTTL-compatible I/O simplifies interfacing with other system components.
  • Reliable operation: Designed for robust performance in demanding environments.

Additional Details:

The IS61WV12816EDBLL-8TLI operates from a single 3.3V power supply. The device supports byte write operations, allowing for flexible data manipulation. The ZZ mode provides automatic power-down functionality when the device is deselected, further reducing power consumption. The operating temperature range is -40°C to +85°C. It is offered in a 48-ball Fine-Pitch Ball Grid Array (FBGA) package for efficient board-level assembly.

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