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IL-G-8P-S3L2-SA

Part No IL-G-8P-S3L2-SA
Manufacturer JAE Electronics
Catalog Rectangular Connectors
Description CONN HEADER R/A 8POS 2.5MM
Sample
Rohs State rohs
ECAD Module
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Categories Connectors
Estimated Pruduction Lead Time 13 Weeks
Features Connector Header Through Hole, Right Angle 8 position 0.098" (2.50mm)
Manufacturer JAE Electronics
Series IL-G
Package Bulk
Operating Temperature Range -40°C ~ 85°C
Mounting Through Hole, Right Angle
Family Name IL-G-8P
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Other Part Number 670-2554, ILG8PS3L2SA, -IL-G-8P-S3L2-SA
Quantity per package 1
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 874535-IL-G-8P-S3L2-SA
Ultra Librarian 3D Model Ultra Librarian IL-G-8P-S3L2-SA CAD Model

Description

The IL-G-8P-S3L2-SA is a wire-to-board connector manufactured by JAE Electronics. It is part of the IL-G series, designed for reliable and secure connections in various electronic applications. This connector features a compact design and is suitable for applications requiring high-density interconnections.

Applications

  • Internal wiring in electronic devices
  • Signal and power connections on PCBs
  • Board-to-wire connections
  • Data communication equipment
  • Consumer electronics

Features

  • Compact design for high-density mounting
  • Secure locking mechanism
  • Reliable contact performance
  • RoHS compliant
  • Easy wire termination
  • Polarization features to prevent mismating

Benefits

  • Saves space on PCBs due to its compact size.
  • Ensures a secure and reliable connection, preventing accidental disconnection.
  • Provides consistent electrical performance.
  • Complies with environmental regulations.
  • Simplifies the assembly process.

Specifications

The IL-G-8P-S3L2-SA features 8 pins/circuits. It supports a specific wire gauge range, typically 26-30 AWG. The voltage and current ratings are dependent on the specific application and standards. Consult the JAE Electronics datasheet for detailed specifications, including material information, mating force, unmating force, and environmental performance.

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