The TEPSLB31C336M55PHF8R is a surface-mount aluminum electrolytic capacitor manufactured by Kemet. It is characterized by a long operational lifespan and high reliability, making it suitable for demanding applications where consistent performance is crucial.

Applications

• Power supplies (specifically in smoothing and filtering circuits)
• Inverters
• DC-DC converters
• Renewable energy systems (solar inverters, wind turbine converters)
• Industrial equipment

Features

• Surface mount design for automated assembly
• Aluminum electrolytic construction
• High capacitance value (33µF)
• Voltage rating of 55V DC
• Operating temperature range is broad, allowing usage in a variety of environments
• RoHS compliant

Benefits

• Provides stable and reliable performance over its lifespan.
• Space-saving design due to its surface-mount configuration.
• Reduces noise and ripple in power circuits.
• Helps to maintain consistent voltage levels in demanding applications.
• Contributes to the overall efficiency and reliability of electronic systems.

Additional Details

The TEPSLB31C336M55PHF8R features a capacitance of 33 microfarads (µF) with a tolerance that allows for slight variations from the nominal value. Its voltage rating of 55V DC indicates the maximum DC voltage that can be safely applied to the capacitor. The capacitor's Equivalent Series Resistance (ESR) is an important parameter, especially in power applications, as it affects the capacitor's ability to handle ripple current. Kemet's datasheets provide specific ESR values for different frequencies and temperatures. The capacitor's lifetime is a key performance indicator, typically specified in hours at a certain temperature (e.g., 2000 hours at 105°C). It is designed to withstand reflow soldering processes, making it suitable for automated PCB assembly. This capacitor is commonly used for decoupling, smoothing, and filtering in electronic circuits due to its effectiveness in reducing voltage ripple and noise. The compact size and surface mount configuration allow for high-density circuit designs and automated manufacturing processes.