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MT48H8M32LFB5-75:G

Part No MT48H8M32LFB5-75:G
Manufacturer Micron Technology Inc.
Catalog Unclassified Memory
Description Mobile SD-133 8Mx32 FBGA90
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Series *
Win Source Part Number 944797-MT48H8M32LFB5-75:G
Ultra Librarian 3D Model Ultra Librarian MT48H8M32LFB5-75:G CAD Model

Description

The MT48H8M32LFB5-75:G is a 256Mb DDR2 SDRAM (Double Data Rate Two Synchronous Dynamic Random-Access Memory) device manufactured by Micron Technology Inc. It is organized as 8Meg x 32, making it well-suited for applications that benefit from a wider data bus and moderate memory capacity. The ':G' likely denotes a specific revision or speed grade.

Applications

  • Embedded Systems
  • Networking equipment
  • Graphics Cards (low-end)
  • Set-top boxes
  • Industrial control systems

Features

  • 256Mb (8Meg x 32) memory configuration
  • DDR2 architecture: Provides increased bandwidth compared to DDR SDRAM
  • Clock rate: Up to 133 MHz (7.5ns cycle time), based on the '-75' designation.
  • Double data rate operation: Transfers data on both the rising and falling edges of the clock.
  • Four internal banks for concurrent operation
  • Programmable burst length: 2, 4, 8
  • Programmable CAS latency: 3, 4, 5
  • On-die termination (ODT): Improves signal integrity for high-speed operation.
  • Differential clock inputs (CK and CK#)
  • Lead-free construction, RoHS compliant

Benefits

  • Higher bandwidth: DDR2 technology enables faster data transfer rates, enhancing system performance.
  • Wider data bus: The 32-bit data bus improves data throughput in certain applications.
  • Moderate memory capacity: Offers sufficient memory for a variety of embedded and consumer applications.
  • Improved signal integrity: On-die termination minimizes signal reflections and noise, ensuring reliable operation.
  • Lower power consumption: DDR2 operates at a lower voltage than DDR, reducing power consumption.

Additional Details

The MT48H8M32LFB5-75:G typically operates at 1.8V. It is packaged in a FBGA (Fine-pitch Ball Grid Array) for efficient surface mounting and heat dissipation. Its DDR2 architecture offers a good balance between performance and power efficiency. The 32-bit data bus makes it suitable for applications where data is processed in larger chunks.

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