The Molex 52266-0311 is a MicroClasp Wire-to-Board Header. It is a compact and reliable connector designed for various electronic applications where space is limited and secure connections are crucial.

Applications:

• Consumer Electronics (e.g., digital cameras, smartphones, tablets)
• Industrial Automation Equipment
• Medical Devices
• Automotive Electronics
• Robotics
• Gaming Consoles
• Printers and Scanners
• Security Systems
• Lighting Systems

Features:

• MicroClasp Design: Provides a secure locking mechanism to prevent accidental disconnection.
• Compact Size: Space-saving design ideal for high-density applications.
• Wire-to-Board Configuration: Connects wires directly to a printed circuit board (PCB).
• 3 Circuits: Accommodates three individual connections.
• Single Row: Streamlined design for easy integration.
• Surface Mount Technology (SMT): Designed for automated assembly processes.
• High Temperature Resistant: Suitable for reflow soldering processes.

Benefits:

• Secure Connection: The MicroClasp ensures a reliable connection, reducing the risk of signal interruption.
• Space Efficiency: The compact design allows for greater component density on the PCB.
• Easy Integration: The wire-to-board configuration simplifies assembly and reduces wiring complexity.
• Automated Assembly: SMT compatibility enables efficient and cost-effective manufacturing.
• Durable Performance: Designed to withstand harsh environments and maintain stable connections.

Specifications:

The Molex 52266-0311 has a 1.25mm pitch. It's made of high-temperature thermoplastic that can withstand reflow soldering temperatures. The housing is typically white or natural in color. The contact material is typically tin-plated or gold-plated to ensure good conductivity and corrosion resistance. The connector is designed for a voltage rating of typically 50V and a current rating of typically 1A per contact. It is RoHS compliant.