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54AC374LMQB/QS

Part No 54AC374LMQB/QS
Manufacturer National Semiconductor (TI)
Catalog OEM Parts (0 - 9)
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Win Source Part Number 1025403-54AC374LMQB/QS
Categories OEM Parts(0-9)
Manufacturer National Semiconductor (TI)
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian 54AC374LMQB/QS CAD Model

Description

The 54AC374LMQB/QS is an octal D-type flip-flop with TRI-STATE outputs from Texas Instruments (formerly National Semiconductor). This advanced CMOS device is designed for high-speed performance and low power consumption, making it suitable for a wide range of applications including military and aerospace systems where reliability is paramount.

Applications:

  • Military and aerospace data processing systems
  • High-performance memory storage
  • Bus interface in critical applications
  • Data registers in embedded systems
  • Control and data buffering

Features:

  • Advanced CMOS Technology: Provides high speed and low power consumption.
  • TRI-STATE Outputs: Allows direct interface to bus-oriented systems.
  • Octal configuration: Provides eight independent flip-flops for parallel data storage.
  • Positive-edge triggered D-type flip-flops: Simplifies circuit design and timing.
  • Military Temperature Range: Guaranteed performance from -55°C to +125°C.

Benefits:

  • Improved System Performance: Offers fast propagation delays, enhancing system speed.
  • Reduced Power Consumption: Advanced CMOS technology minimizes power usage.
  • Simplified Bus Interface: TRI-STATE outputs facilitate easy integration into bus-oriented architectures.
  • Efficient Data Storage: Provides a convenient way to store and retrieve data in parallel.
  • High Reliability: Designed for operation in harsh environmental conditions.

The 54AC374LMQB/QS is characterized for operation over the full military temperature range of -55°C to +125°C. It operates from a 3V to 5.5V supply and features high noise immunity. The TRI-STATE outputs are capable of driving highly capacitive loads, making it suitable for various bus applications. This device is typically packaged in a ceramic DIP or flatpack package to ensure ruggedness and reliability, meeting stringent military and aerospace requirements. The 'QS' suffix may indicate specific screening or quality levels.

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