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Manufacturer NEC
Win Source Part Number 389588-UPA652TT-E1
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian UPA652TT-E1 CAD Model

Description

The UPA652TT-E1 is a power MOSFET manufactured by NEC. This component is designed for high-speed switching applications and is commonly utilized in various power management and control circuits. It offers efficient performance and reliable operation, making it suitable for a wide array of electronic devices.

Applications

  • DC-DC converters
  • AC-DC power supplies
  • Motor control circuits
  • Switching regulators
  • Power management in portable devices

Features

  • Low on-resistance, minimizing power loss and heat generation.
  • High-speed switching capability, enabling efficient operation in high-frequency circuits.
  • Avalanche energy rated, providing robustness against transient voltage spikes.
  • Logic level drive, allowing direct interfacing with microcontrollers and other logic devices.
  • Surface mount package for easy integration into automated assembly processes.

Benefits

  • Improved energy efficiency due to low on-resistance, reducing overall power consumption.
  • Enhanced system performance through rapid switching speeds, enabling faster response times.
  • Increased reliability and durability with avalanche energy rating, protecting against voltage surges.
  • Simplified circuit design with logic-level drive, streamlining integration with control systems.
  • Reduced board space requirements with a compact surface mount package, ideal for space-constrained applications.

Additional Details

The UPA652TT-E1 typically features a drain-source voltage (Vds) rating suitable for common power supply voltages. The gate-source voltage (Vgs) is designed to be compatible with standard logic levels. Its low gate charge (Qg) contributes to fast switching speeds and reduced switching losses. It comes in a small surface mount package. Consult the datasheet for precise electrical characteristics, thermal resistance, and package dimensions to ensure proper application and thermal management. Proper heatsinking might be required depending on the operating conditions to maintain the device within its safe operating area.

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