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UPC2726T

Part No UPC2726T
Manufacturer NEC
Catalog Electronic Wholesale
Description 1.6 GHz DIFFERENTIAL WIDE BAND AMPLIFIER SILICON BIPOLAR MONOLITHIC INTEGRATED CIRCUIT
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Manufacturer NEC
Win Source Part Number 1277602-UPC2726T
Manufacturer Homepage www.nec.com/
Popularity Medium
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Description

The UPC2726T is a Silicon NPN Wideband Transistor manufactured by NEC (now Renesas Electronics). It is designed for high-frequency amplifier applications, particularly in communication systems. This transistor is suitable for use in various RF and microwave circuits where high gain and low noise are required.

Applications:

  • RF Amplifiers
  • Oscillators
  • Mixers
  • Communication Systems
  • Instrumentation Equipment

Features:

  • High Transition Frequency (fT): Provides excellent high-frequency performance.
  • Low Noise Figure: Minimizes unwanted noise in amplifier circuits.
  • High Gain: Delivers substantial signal amplification.
  • Small Package: Allows for compact circuit designs.
  • Silicon NPN Technology: Ensures reliable performance and consistent characteristics.

Benefits:

  • Improved Signal Quality: Low noise figure enhances signal clarity in sensitive applications.
  • Extended Frequency Range: High transition frequency supports use in a wide range of RF and microwave applications.
  • Simplified Circuit Design: High gain reduces the number of stages required for amplification.
  • Compact Solutions: Small package enables miniaturization of electronic devices.
  • Reliable Performance: Silicon NPN technology provides consistent and predictable behavior.

Technical Specifications:

The UPC2726T typically features a high transition frequency (fT) in the GHz range. The noise figure is specified to be low for optimal performance in sensitive receiver applications. The transistor's gain is also a key parameter, providing efficient amplification. Detailed electrical characteristics, including voltage and current ratings, can be found in the manufacturer's datasheet.

This transistor is commonly available in surface-mount packages, which are suitable for automated assembly processes. Its high-frequency capabilities and low noise characteristics make it an excellent choice for RF and microwave amplifier designs.

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