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74AUP1G09GW

Part No 74AUP1G09GW
Manufacturer NXP / Nexperia
Catalog Hard To Find
Description AND Gate 1-Element 2-IN CMOS Automotive 5-Pin TSSOP / Low-power 2-input AND gate with open-drain
Sample
Rohs State rohs
ECAD Module
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Manufacturer NXP
Win Source Part Number 1131035-74AUP1G09GW
Manufacturer Homepage www.nxp.com
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Balance
Family Name 74AUP1G09
Introduction Date January 14, 2009
ECCN EAR99
Country of Origin Malaysia
Halogen Free Compliant
Estimated EOL Date 2027
Ultra Librarian 3D Model Ultra Librarian 74AUP1G09GW CAD Model

Description

Product Overview: 74AUP1G09GW by NXP

The 74AUP1G09GW is a high-performance, low-power single 2-input AND gate integrated circuit, meticulously designed by NXP Semiconductors to meet the demands of modern electronics. This component is a part of the advanced ultra-low power (AUP) family, which is renowned for its low power consumption while maintaining high-speed operation.

Key Features

  • Low Static Power Consumption: The 74AUP1G09GW boasts an incredibly low static power consumption (ICC) of only 0.9 µA max, making it ideal for battery-operated and power-sensitive applications.
  • High-Speed Performance: Despite its low-power design, this IC does not compromise on speed, offering a typical tpd of 3.5 ns.
  • Wide Operating Voltage Range: It operates over a wide voltage range of 0.8 V to 3.6 V, providing design flexibility across different power domains.
  • Low Noise Overshoot and Undershoot: This feature ensures signal integrity, which is critical in high-speed digital circuits.
  • ESD Protection: The device includes input and output ESD protection, exceeding JESD22 with a 3.6 V tolerant to support interfacing with higher voltage logic levels.
  • Temperature Range: The 74AUP1G09GW is designed to operate over a -40 °C to +125 °C temperature range, making it suitable for industrial and automotive applications.

Applications

The versatility of the 74AUP1G09GW allows it to be used in a broad array of applications, including:

  • Smartphones and portable electronics
  • Computing devices and peripherals
  • Microcontroller interfacing
  • Energy management systems
  • Automotive electronics

Package Details

The 74AUP1G09GW comes in a leadless ultra-small XSON6 package, which occupies minimal board space and is ideal for space-constrained applications. Its package dimensions are a mere 1.0 mm x 1.45 mm, with a height of 0.5 mm.

In conclusion, the 74AUP1G09GW from NXP is a testament to the company's commitment to providing innovative, low-power, and high-performance integrated circuits. Its robust feature set and compact form factor make it an excellent choice for designers looking to optimize their power budgets while maintaining high-speed operation in their digital logic solutions.

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Pricing & Ordering

Quantity Unit Price Ext. Price
110+ $0.4627 $50.8970
235+ $0.4329 $101.7315
360+ $0.4180 $150.4800
520+ $0.3881 $201.8120
670+ $0.3732 $250.0440
840+ $0.3583 $300.9720
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 101,900 pieces
MOQ: 110 pcs
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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