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74AUP2G125GN,115

Part No 74AUP2G125GN,115
Manufacturer NXP / Nexperia
Catalog Logic - Buffers, Drivers, Receivers, Transceivers
Description IC BUFFER NON-INVERT 3.6V 8XSON  /  Buffer, Non-Inverting 2 Element 1 Bit per Element 3-State Output 8-XSON (1.2x1)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Logic - Buffers, Drivers, Receivers, Transceivers
Mfr NXP USA Inc.
Series 74AUP
Package Bulk
Logic Type Buffer, Non-Inverting
Number of Elements 2
Number of Bits per Element 1
Output Type 3-State
Current - Output High, Low 4mA, 4mA
Voltage - Supply 0.8V ~ 3.6V
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 8-XFDFN
Supplier Device Package 8-XSON (1.2x1)
Base Product Number 74AUP2G125
ECCN EAR99
HTSUS 8542.39.0001
Other Names 2156-74AUP2G125GN,115,NEXNEX74AUP2G125GN,115
Standard Package 1
Win Source Part Number 1135890-74AUP2G125GN,115
Ultra Librarian 3D Model Ultra Librarian 74AUP2G125GN,115 CAD Model

Description

The 74AUP2G125GN,115 is a high-performance, dual non-inverting buffer/line driver with 3-state outputs, designed and manufactured by NXP Semiconductors. It is part of NXP's advanced ultra-low power (AUP) family, which is optimized for low-voltage operation and is ideal for battery-powered and portable devices.

Key Features

  • Low-Voltage Operation: The device operates at a very low voltage range of 0.8V to 3.6V, making it suitable for various applications that require efficient power usage.
  • High-Speed Interface: With a maximum propagation delay of only 3.5ns and transition times of 3.5ns at a 1.8V supply, this buffer/line driver ensures high-speed data transmission.
  • Low Power Consumption: The device is designed for ultra-low power consumption with a typical I_cc of 0.9µA, which is ideal for extending battery life in portable applications.
  • 3-State Outputs: The inclusion of 3-state outputs allows for connection to a bus or multiple outputs without interference, providing greater flexibility in complex circuits.
  • ESD Protection: High electrostatic discharge (ESD) protection levels are provided, with HBM ESD protection exceeding 500V, ensuring robustness and reliability of the device in challenging environments.
  • Compact Design: Housed in a compact, leadless XSON8 package with a body size of 1.35 x 1 mm, the 74AUP2G125GN,115 is designed for space-constrained applications.

Applications

The 74AUP2G125GN,115 is versatile and can be used in a variety of applications, including:

  • Smartphones, tablets, and other portable devices
  • Mobile communication systems
  • Data storage and memory interfaces
  • Microprocessor or microcontroller interface
  • Level shifting applications due to its wide voltage range

Environmental and Quality Certifications

NXP's commitment to quality and environmental sustainability is evident in the 74AUP2G125GN,115, as it complies with the following standards:

  • RoHS compliant
  • Pb-Free (Lead-Free) package
  • Green product, supporting NXP's green initiatives

With its combination of low-power operation, high-speed performance, and compact design, the 74AUP2G125GN,115 from NXP Semiconductors is an excellent choice for designers looking to optimize their high-speed digital interfacing applications.

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