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MC33389DDWR2

Part No MC33389DDWR2
Manufacturer NXP / Nexperia
Catalog Interface - Specialized
Description IC INTERFACE SPECIALIZED 28SOIC / Automotive Interface 28-SOIC
Sample
Rohs State Need to verify
ECAD Module
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Category Integrated Circuits (ICs) - Interface - Specialized
Mfr NXP
Package Tape & Reel (TR)Cut Tape (CT)
Product Status Obsolete
Applications Automotive
Interface CAN
Voltage - Supply 5.5V ~ 18V
Package / Case 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC
Mounting Type Surface Mount
Base Product Number MC333
Standard Package 1,000 pcs
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 489315-MC33389DDWR2
Ultra Librarian 3D Model Ultra Librarian MC33389DDWR2 CAD Model

Description

The MC33389DDWR2 is a sophisticated automotive interface component manufactured by NXP Semiconductors, a leader in the automotive industry. This integrated circuit is designed to provide a reliable interface between the vehicle's on-board microcontroller and the physical layer of the Controller Area Network (CAN), which is a robust vehicle bus standard that allows microcontrollers and devices to communicate with each other within a vehicle without a host computer.

Key Features

  • High-Speed CAN Interface: The MC33389DDWR2 supports the high-speed CAN protocol, ensuring fast and efficient communication between electronic control units (ECUs).
  • Low-Power Mode: It includes a low-power mode with wake-up capability, helping to reduce the overall power consumption of the vehicle's electronic systems.
  • Thermal Protection: The device incorporates thermal protection features, safeguarding it against the potential risks of overheating.
  • Transceiver Functionality: As a transceiver, it translates signals from the CAN protocol to levels that are compatible with the microcontroller, and vice versa.

Applications

The MC33389DDWR2 is largely used in automotive applications due to its robustness and reliability in harsh environments. It's suitable for a wide range of applications within the vehicle, such as:

  • Engine Control Modules
  • Anti-lock Braking Systems
  • Airbag Systems
  • Advanced Driver-Assistance Systems
  • Infotainment Systems

Technical Specifications

The device is housed in a wide-body SOIC package, ensuring ease of integration into automotive systems with standard surface-mount technology. It operates over a broad temperature range, making it suitable for the diverse thermal conditions encountered in automotive environments.

Quality and Reliability

NXP's commitment to quality and reliability is evident in the MC33389DDWR2, which is designed to meet the stringent requirements of the automotive industry. With its robust design and advanced features, it ensures reliable communication in critical vehicle systems, contributing to the safety and efficiency of modern automobiles.

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