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RFGA2054PCK-410

Part No RFGA2054PCK-410
Manufacturer Qorvo US Inc.
Catalog Custom Parts (N - R)
Description RFGA2054 50MHz to 3000MHz InGaP HBT MMIC Amplifier Evaluation Board
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Win Source Part Number 1232501-RFGA2054PCK-410
Categories Custom Parts
Manufacturer Qorvo US Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian RFGA2054PCK-410 CAD Model

Description

The Qorvo RFGA2054PCK-410 is a Gallium Nitride (GaN) based front-end module (FEM) designed for high-power, high-efficiency applications in the 2.4 GHz ISM band, typically used for Wi-Fi and other wireless communication systems. This FEM integrates a power amplifier (PA), a low-noise amplifier (LNA), and a transmit/receive (T/R) switch, providing a complete front-end solution for wireless transceivers. The use of GaN technology enables high power output and efficiency, while the integrated design simplifies system integration and reduces board space requirements.

Applications

  • Wi-Fi 6 (802.11ax) Access Points
  • Wireless routers
  • Internet of Things (IoT) devices
  • Smart home devices
  • Wireless security systems

Features

  • Integrated Power Amplifier (PA)
  • Integrated Low-Noise Amplifier (LNA)
  • Integrated Transmit/Receive (T/R) Switch
  • High output power
  • High power efficiency
  • Compact module size

Benefits

  • Extended range and coverage in wireless systems
  • Improved receiver sensitivity
  • Simplified system design and integration
  • Reduced board space requirements
  • Lower power consumption

Additional Details

The RFGA2054PCK-410 operates in the 2.4 GHz ISM band and is designed to meet the requirements of modern Wi-Fi standards. The GaN-based power amplifier provides high output power while maintaining high efficiency, reducing power consumption and heat dissipation. The integrated LNA improves receiver sensitivity, enabling the system to detect weaker signals. The T/R switch allows the antenna to be shared between the transmitter and receiver, simplifying system design and reducing component count. The module is typically packaged in a surface-mount package for easy assembly onto printed circuit boards. Detailed specifications, including output power, gain, noise figure, and isolation, can be found in the product datasheet.

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