The AR9350-DC3B is a highly integrated system-on-a-chip (SoC) from Qualcomm Atheros, primarily designed for wireless networking applications. It combines a MIPS 74Kc processor core, a 2.4/5 GHz dual-band concurrent wireless radio, and various peripheral interfaces. This makes it suitable for high-performance routers, access points, and other embedded systems requiring robust Wi-Fi connectivity and processing capabilities.

Applications

• High-Performance Wireless Routers: Used in routers that require dual-band concurrent Wi-Fi operation.
• Wireless Access Points: Integrated into enterprise-grade access points for reliable network connectivity.
• Wireless Repeaters/Extenders: Employed in devices that extend the range of Wi-Fi networks.
• Mesh Networking Devices: Utilized in mesh networking systems for seamless wireless coverage.
• Industrial Wireless Applications: Found in industrial control systems and wireless sensor networks.

Features

• MIPS 74Kc Processor Core: Includes a MIPS 74Kc processor for general-purpose processing.
• 2.4/5 GHz Dual-Band Concurrent Wireless Radio: Supports simultaneous operation on both 2.4 GHz and 5 GHz bands.
• 802.11a/b/g/n Wi-Fi Standards: Compatible with a wide range of Wi-Fi standards.
• Integrated Ethernet Switch: Features a built-in Ethernet switch for wired network connectivity.
• USB 2.0 Host Port: Provides USB connectivity for external devices.

Benefits

• High Performance: Delivers fast and reliable wireless connectivity for demanding applications.
• Dual-Band Operation: Supports simultaneous operation on both 2.4 GHz and 5 GHz bands, reducing interference.
• Wired Connectivity: Offers Ethernet connectivity for devices requiring wired network access.
• Flexible Architecture: Supports a wide range of software and firmware configurations.
• Enhanced Security: Incorporates advanced security features to protect network traffic.

Technical Specifications

The AR9350-DC3B integrates a MIPS 74Kc processor core, a 2.4/5 GHz 802.11a/b/g/n wireless radio, a 5-port Ethernet switch, and a USB 2.0 host port. It supports various security protocols, including WEP, WPA, and WPA2. The specific clock speed of the processor and the amount of integrated memory may vary. The device is typically packaged in a BGA (Ball Grid Array) package for surface mount assembly and designed for optimal thermal performance.