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QFE-3100-0-29WLPSP-SR-0A-0

Part No QFE-3100-0-29WLPSP-SR-0A-0
Manufacturer Qualcomm
Catalog Electronic Wholesale
Sample
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ECAD Module
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Reference Date Code 1607+
Reference case BGA
Manufacturer QUALCOMM
Win Source Part Number 755793-QFE-3100-0-29WLPSP-SR-0A-0
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian QFE-3100-0-29WLPSP-SR-0A-0 CAD Model

Description

The QFE-3100-0-29WLPSP-SR-0A-0 is a front-end module (FEM) manufactured by Qualcomm. It is designed for use in mobile devices to enhance RF performance. The QFE-3100 is a critical component in modern cellular communication systems.

Applications:

  • Mobile phones
  • Tablets
  • Wireless communication devices
  • IoT devices with cellular connectivity

Features:

  • Multi-band support: Supports multiple frequency bands used in cellular communication.
  • Integrated filters: Includes filters to reject unwanted signals and improve signal quality.
  • Low insertion loss: Minimizes signal loss, improving overall efficiency.
  • High linearity: Ensures accurate signal transmission and reception.
  • Compact size: Designed for integration into small mobile devices.
  • Power Amplifier (PA) support: Optimized to work with Qualcomm's Power Amplifiers.

Benefits:

  • Improved call quality: Enhances signal strength and clarity for better voice communication.
  • Faster data speeds: Enables faster data transfer rates for improved browsing and streaming.
  • Extended battery life: Low insertion loss and efficient design contribute to longer battery life.
  • Increased network coverage: Improves signal reception in areas with weak signal strength.
  • Reduced interference: Filters out unwanted signals, minimizing interference.

Technical Specifications:

The QFE-3100-0-29WLPSP-SR-0A-0 is designed to support various cellular standards, including GSM, WCDMA, and LTE. It integrates multiple filters and switches to provide optimized performance across different frequency bands. The module is packaged in a compact WLPSP (Wafer Level Package Scale Package) for easy integration into mobile devices. It operates within a specified voltage range, typically 2.8V to 5.0V. The operating temperature range is -40°C to +85°C, ensuring reliable performance in various environmental conditions. The module's low insertion loss, typically less than 1 dB, minimizes signal attenuation and maximizes power efficiency. It also incorporates ESD protection to safeguard against electrostatic discharge events.

Qualcomm's QFE series FEMs are designed to provide a complete RF front-end solution for mobile devices, optimizing performance and reducing the complexity of RF design. This module is specifically tailored to work with Qualcomm's chipset solutions, providing seamless integration and optimized performance.

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Pricing & Ordering

Quantity Unit Price Ext. Price
18+ $3.2617 $58.7106
44+ $2.6761 $117.7484
67+ $2.5930 $173.7310
93+ $2.5087 $233.3091
120+ $2.4255 $291.0600
160+ $2.1749 $347.9840
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 6,000 pieces
MOQ: 18 pcs
Order Increment : 1 pcs
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