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Same model may have multiple batches, images only for reference.
70T3339S133BFGI
Same model may have multiple batches, images only for reference.

70T3339S133BFGI

Part No 70T3339S133BFGI
Manufacturer Renesas Electronics America
Catalog SRAM
Description IC SRAM 9MBIT PARALLEL 208CABGA
Datasheet
70T3339S133BFGI Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 19 Weeks
Features SRAM - Dual Port, Synchronous Memory IC 9Mb (512K x 18) Parallel 133 MHz 4.2 ns 208-CABGA (15x15)
Manufacturer Renesas Electronics America
Package Tray
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 208-LFBGA
Case / Package 208-CABGA (15x15)
Family Name 70T3339
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number IDT70T3339S133BFGI, IDT70T3339S133BFGI-ND
Quantity per package 7
Popularity High
Supply and Demand Status Balance
Win Source Part Number 920915-70T3339S133BFGI
Ultra Librarian 3D Model Ultra Librarian 70T3339S133BFGI CAD Model

Description

The Renesas Electronics America 70T3339S133BFGI is an integrated circuit that is designed to meet the needs of various electronic applications.

  • Popularity: High
  • Category: Integrated Circuits (ICs)
  • Package: 208-LFBGA
  • Compliance: RoHS Compliant
  • Manufacturer: Renesas Electronics America
  • Features: SRAM - Dual Port, Synchronous Memory IC 9Mb (512K x 18) Parallel 133 MHz 4.2 ns 208-CABGA (15x15)
  • Operating Temperature Range: -40°C to 85°C (TA)
  • MSL Level: 3 (168 hours)
  • Estimated Production Lead Time: 19 weeks
  • REACH: Unaffected
  • HTSUS: 8542.32.0041
  • Other part numbers: IDT70T3339S133BFGI and IDT70T3339S133BFGI-ND

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