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CIG22K2R2SDF

Part No CIG22K2R2SDF
Manufacturer Samsung
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 14+/Rohs
Reference case 10k pcs/Per Reel
Manufacturer Samsung
Manufacturer Homepage www.samsung.com/Products/Semiconductor
Win Source Part Number 752623-CIG22K2R2SDF
Popularity Low
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian CIG22K2R2SDF CAD Model

Description

The CIG22K2R2SDF is a multilayer ceramic inductor manufactured by Samsung. It's designed for high-frequency applications requiring stable inductance and high self-resonant frequency.

Applications:

  • RF circuits
  • Mobile communication devices
  • Wireless LAN systems
  • Bluetooth modules
  • Matching networks
  • Filtering circuits

Features:

  • Multilayer ceramic construction: Provides high Q factor and stable inductance.
  • High self-resonant frequency: Enables operation at high frequencies without significant performance degradation.
  • Small size: Suitable for compact electronic devices.
  • Surface mount design: Facilitates automated assembly.
  • Excellent solderability: Ensures reliable connection to the PCB.

Benefits:

  • Improved RF performance: Enhances signal quality in RF circuits.
  • Reduced signal loss: Minimizes energy dissipation in high-frequency applications.
  • Stable operation: Maintains consistent inductance value over a wide range of operating conditions.
  • Compact design: Allows for integration into small electronic devices.
  • Reliable performance: Ensures consistent and dependable operation.

Additional Details:

The CIG22K2R2SDF inductor's key specifications include its inductance value (2.2nH), tolerance, Q factor, self-resonant frequency (SRF), and DC resistance (DCR). These parameters are critical for selecting the appropriate inductor for a specific application. The multilayer ceramic construction provides excellent stability and minimizes losses, making it suitable for demanding RF applications. It is often used in mobile phones, wireless communication modules, and other high-frequency devices. The small size and surface-mount design allow for easy integration into compact electronic devices.

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